一般感压型的切割胶带，是在各种硅片等的切割工程中使用的胶带。对应多样化的需求，提供适合的胶带。

UV型的切割胶带，是在各种硅片、封装基板、陶瓷、玻璃、水晶等多种工件的切割工程中使用的胶带。

通过使用紫外线，降低粘着力，使之更易剥离。

adhesion

has good adhesion to the uneven surface on the front of the wafer, and can fit tightly, effectively protecting the circuit on the front of the wafer.

grindability stable

ensures stable grinding performance when grinding on the backside, achieving low TTV (Total Thickness Variation) and ensuring grinding accuracy.

low dust <

adhesion and peel stability

adhesive changes over time, the peelability is stable, and there will be no problems such as the tape being difficult to peel off or the remaining glue after peeling during use.

has superior time-over stability

has superior time-stable stability, which can maintain stable performance for a long time and ensure the consistency of product quality.

to reduce back collapse and prevent flying materials

can reduce the occurrence of back collapse, and at the same time prevent flying materials and chip splashing during the grinding process, improving production safety and product yield.

also has high-quality adhesion to difficult-to-bond workpieces such as EMC (semiconductor epoxy synthetic polymer packaging materials), and is widely applicable.

models have anti-static functions, which can meet the needs of some production environments that are sensitive to static electricity.