日本ShinEtsu信越电子材料装置正变得功能很高，但却产生热量也越来越高。热界面材料是防止电子器件发热的重要材料。

ShinEtsu LED optical device application role of Japan

high adhesion and adhesion stability;

high temperature stability;

silicone highly thermally conductive materials have good adhesion and high thermal resistance. We have extensive market experience from equipment to heat sinks to improve reliability and stability of electronic devices.

ShinEtsu Thermal Interface Electronic Materials Industry Application Role in Japan

high viscosity and low stress;

MSL level;

thermal bonding materials of epoxy high thermal conductivity material elements and heat sinks. By developing Shin-Etsu's unique low-modulus technology, it can be used for molds to highly meet the MSL performance at the material level.

the industrial application role of ShinEtsu Semiconductor molded electronic materials in Japan

high thermal conductivity;

good formability;

low warpage;

develop advanced packaging materials that encapsulate various semiconductor packaging materials for devices with high thermal conductivity. Shin-Etsu has introduced electromagnetic compatibility of "green" halogen and antimony trioxide, which helps protect the environment.

Precautions for the use of materials by ShinEtsu Shin-Etsu in Japan

Store tightly in a cool place away from sunlight.

●Before using this product, remove it from the cold storage and reheat it to ambient temperature. Maintain the drying properties of products and assembly equipment. Voids and degradation of other important properties that can be caused by moisture contamination.

● Reasonable disposal to avoid skin contact. It is recommended to wear appropriate protection. If skin contact occurs, wash thoroughly with soap and water.In case of eye contact, rinse immediately with water and seek medical attention.

resins are formulated to avoid inhaling vapors or dust, and may cause ducts or indoor ventilation systems.

●Please read the Material Data Sheet (MSDS) before use.

日本ShinEtsu信越LED光学器件电子材料种类型号及应用参数

日本ShinEtsu信越热界面电子材料种类型号及工业应用参数

日本ShinEtsu信越半导体模压电子材料种类型号及工业应用参数

* Tg = Glass transition temperature