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type of PCB
divide the PCB into single-sided, double-sided and multi-layer boards according to the distribution of printed circuits; According to mechanical properties, it can be divided into flexible plates and rigid plates.
copper foil substrates are based on upstream materials such as reinforcement, conductivity, and bonding, and we have started manufacturing copper foil substrates. Copper foil substrates are mainly made of resin (epoxy resin, phenolic resin, polyimide resin) plus reinforcement materials (glass cloth, insulating paper), and copper foil is added on one or both sides under high temperature and pressure.
产品 树脂类型 醚化类型 固含 黏度 游离甲醛 300 三聚氰胺树脂 甲醚化 >98 Wax <0.25 303LF 三聚氰胺树脂 甲醚化 >98 Y-Z2 <0.1 350 三聚氰胺树脂 甲醚化 >97 Z2-Z5 <1.0 370N 三聚氰胺树脂 甲醚化 78-82 Z2-Z4 <2.5 325N 三聚氰胺树脂 甲醚化 78-82 X-Z1 <0.5 159 苯代树脂 甲醚化 75-79 Z1-Z4 <0.15 9411 苯代树脂 丁醚化 73-77 R-V <1.5 U65 脲醛树脂 甲醚化 >96 Z3-Z6 <0.4 U1052-8 脲醛树脂 丁醚化 54-58 R-U <0.75 1170 聚脲树脂 丁醚化 >96 Z-Z2 <0.35 1172 聚脲树脂 丁醚化 43-47 low <1.0
