全国服务热线：199 0247 3302
邮箱：ailand@dgailand.com
业务咨询：199 0247 3302
技术咨询：135 8090 5315
地址：广东省东莞市松山湖园区科技三路7号 中国南方应急大厦1栋607室
BERGQUIST® SIL PAD® TSP K1300 is a high-performance material developed in conjunction with DuPont®. By combining a special Kapton® MT polyimide film with boron nitride-filled silicone rubber, the product exhibits high performance and good puncture resistance. It is a durable material that can be used as an alternative to fragile and expensive ceramic insulators.
BERGQUIST® SIL PAD® TSP 3500 is a pre-cured rigid thermally conductive insulating pad for thermal conductivity at the interface between the fins/metal housing and the component. Its unique filler/matrix formulation optimizes both thermal and dielectric properties. The flexible material is fat-free and reinforced with glass fiber, providing a high-reliability solution for electronic device packaging applications. Typical applications include power supplies, motor controllers, power semiconductors, aerospace equipment, and avionics systems.
| 产品分类 | 应用 | 产品型号 | 产品特性 |
| 导热 SIL PAD 材料 | 电绝缘、聚酰亚胺增强的绝缘垫 — 高性能 | BERGQUIST® SIL PAD® TSP K1300 | 这种导热、聚酰亚胺增强的绝缘垫旨在替代脆弱且昂贵的陶瓷绝缘子。良好的耐刺穿性。 |
| 电气绝缘垫 — 高性能 | BERGQUIST® SIL PAD® TSP 3500 | 这款高性能导热硅胶绝缘垫专为要求严苛的航空航天及商业应用而设计。具有优异的抗切割性和低热阻抗特性。 |
