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good electrical performance
SMC series is a liquid epoxy encapsulation material used for potting, bonding and underfilling semiconductor devices, and its packaged semiconductor devices have excellent electrical properties, and SMC-7870 may also have this characteristic, which can provide good electrical insulation and signal transmission performance for semiconductor devices.
excellent moisture resistance
this series of materials can protect semiconductor devices from moisture, have good moisture resistance, and can effectively prevent moisture intrusion and avoid the performance degradation or failure of the device due to moisture.
low stress
SMC series materials use Shin-Etsu Chemical's unique silicone technology, which reduces stress, reduces stress impact on semiconductor devices, and improves device reliability and stability.
High heat resistance
as a semiconductor adhesive, it usually needs to have high heat resistance to adapt to the needs of semiconductor devices at different operating temperatures, and can maintain stable performance in higher temperature environments to ensure the normal operation of the device.
| 产品类型 | 产品型号 | 产品性能 | 外观 | 基材 |
| 粘合剂 | SMC-850-4G | Au高附着力 | 液体糊状 | 环氧 |
| LPS-8423TC, 2434, 8425 | 低100摄氏度运行的胶粘剂 | 液体糊状 | 有机硅 | |
| LPS-84228423 | 低废气粘合剂，适用于例如图像传感器和其他光学设备 | 液体糊状 | 有机硅 | |
| KJC-5080H-2 | r.t~60℃低温固化汽车振动测试合格证 | 液体糊状 | 有机硅 | |
| KJR-9602 | 大尺寸模块封装 弹性柔韧性和高附着力 至盖子和其他部件 | 液体糊状 | 有机硅 | |
| SMC-7870, 7870F | 半导体领域的市场经验 封装和模数 加强件.盖子的硬密封 | 液体糊状 | 环氧 | |
| LPS-9416D | 对陶瓷的粘附力高 | 液体糊状 | 有机硅 | |
| LPS-2450 | 可拉伸。可配置粘合剂和涂层材料。（可用于任何柔性基材、聚氨酯等） | 液体糊状 | 有机硅 | |
| LPS-AF-710 | 可折叠粘合膜（使用方法：粘合膜粘贴到任何部件=>折叠部件=>粘附） | 其他 | 有机硅 | |
| 非化学限制，环保型 | KJR-651DS 657DS | 使用欧洲无化学限制溶剂的高耐热涂层（聚酰亚胺） | 液体糊状 | 聚酰亚胺 |
| LED Tiger | 市场认证，可持续发展目标的贡献，带环保外壳的引线框架组件（用于传感器、LED等） | Pacakag E 案例 成形 | 有机硅 |
