heat transfer material

long-term, reliable protection of sensitive circuits and components is becoming increasingly important in today's sensitive electronics applications. With the increasing need for thermal control as processing power increases and the trend toward smaller, higher-density electronic modules increases, Dow Corning's line of thermal conductive materials offers excellent thermal control options. In a wide range of temperature and humidity, thermally conductive silicone can be used as a heat transfer medium, durable dielectric insulation material to resist environmental pollution, and eliminate stress and vibration.

silicone is resistant to cracking of ozone and ultraviolet light and has good chemical stability. Dow Corning's line of thermal control materials includes: adhesives, potting compounds, compounds and gels.

good thermal conductivity depends on a good interface between the heat-generating device and the heat transfer medium. Silicone has low surface tension and can wet most surfaces to reduce the thermal resistance of contact between the substrate and the material.

Heat Conduction Adhesive

Corning offers a wide range of non-corrosive, thermally conductive silicone adhesives for securing hybrid integrated circuit substrates, power semiconductor components, and heat sinks. It can also be used in other bonding operations that require both flexibility and thermal conductivity. Fluid products are also potting materials for transformers, power supplies, coils, relays and other electronic components that need to improve heat dissipation.

heat transfer adhesives can be moisture-cured or heat-cured into durable, relatively low-stress elastomers. One-component, room-temperature curable materials produce no corrosive byproducts and are available in a wide range of viscosities. Room temperature curing heat transfer adhesives are available in both refined and UL-listed products.

热传导粘合剂

类别：

无腐蚀性，单组份，室温湿气固化，以及单或两组份加热固化硅酮弹性体

外观：

非流动的及流动的两种选择；固化成柔性弹性体

特性：

室温或快速热固化；各种不同的热传导性；抵受湿气及其它恶劣环境影响；良好的介电性能；自粘合；低应力

可考虑的应用范围：

散热器或基板连接；灌封电源供应器

热传导灌封胶

类别：

两组份硅酮弹性体

外观：

流动性液体；固化成柔性弹性体

特性：

恒定的固化速率，与灌封厚度或密封程度无关；无需后固化

可考虑的应用范围：

灌封高电压变压器及传感器；安装基材与散热器；作为热源和散热器之间的间隙充填材料

热传导复合物

类别：

不固化；热传导硅酮膏

特性：

高热传导性；低渗油率；高温稳定性

可考虑的应用范围：

热源和散热器之间的间隙充填材料

热传导凝胶

类别：

两组份加热固化

外观：

1:1 混合比率；低粘度

特性：

加热加速固化；大范围的操作温度；固化成低模数材料

可考虑的应用范围：

间隙填充材料；电子模块灌封；热传导凝胶片基材