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Silicone potting compounds


silicone products and electronic components

long-term and effective protection of sensitive circuits and electronic components is undoubtedly playing an increasingly important role in today's sophisticated and demanding electronic applications. Silicone materials have stable dielectric insulation, which is an effective barrier against environmental pollution, and at the same time can eliminate the stress caused by shock and vibration in a wide temperature and humidity range.

In addition to maintaining their physical and electrical properties in a variety of operating environments, silicone materials are resistant to ozone and UV degradation, have good chemical stability, and have a variety of use forms that allow them to be used as conformal coatings, potting adhesives and adhesives.


mixing ratio (by weight or volume); 1:1; 10:1

components (if provided); Component A/Component B; Main agent/curing agent

when the two liquid components are well mixed, the mixture solidifies into a flexible elastomer that protects the electrical/electronic application. Dow Corning silicone potting compounds cure without heat release and cure at a uniform rate, regardless of the thickness of the potting or the tightness of the environment. Dow Corning silicone elastomers do not require secondary curing and are ready for use immediately after curing, operating temperatures from -45 to 200°C (-49 to 392°F). In order to obtain good adhesive performance during bonding, general silicone potting compounds without primer only need to be surface cleaned during bonding.



Product Details


双组分有机硅弹性体

类型:

弹性体

外观

双组分有机硅弹性体

特性

流动性液体;固化后形成柔性弹性体;固化速度均匀,与灌封的厚度和环境的密闭程度无关;使用温度在-45 到 200°C(-49 到 392°F);无需二次固化

Product information
产品产品描述特性
有机硅灌封胶
Sylgard®160有机硅弹性体低成本,良好的热导性双组分;1:1混合;室温固化/升温加速固化;较小的收缩性;固化过程无放热;无溶剂或固化副产物;可修复;良好的介电性能;深层固化;柔性弹性体
Sylgard®165有机硅弹性体快速固化,低成本,良好的导热性
Sylgard®170有机硅弹性体低粘度
Sylgard®170快速固化有机硅弹性体快速固化,低粘度
道康宁®96-082A&B灌封胶超低粘度;阻燃性;非熔化性;自熄性;超长的适用期;宽泛的使用温度
Sylgard®182有机硅弹性体透明;长适用期;加热固化双组分;10:1混合;较小的收缩性;固化过程无放热;无溶剂或固化副产物;深层固化;可修复;良好的介电性能;柔性弹性体
Sylgard®184有机硅弹性体透明;室温固化/升温加速固化
Sylgard®186有机硅弹性体无色;室温固化/升温加速固化;高撕裂强度
道康宁®3-6121灌封弹性体可在低于-65°C(-85°F)低温环境下使用;无色;高撕裂强度和拉伸强度;室温固化/升温加速固化;高折射率
无底涂有机硅灌封胶
道康宁®3-8264无底涂有机硅粘合剂优异的无底漆粘合性;加热固化;弹性体双组分;1:1混合;加热固化;较小的收缩性;固化过程无放热;无溶剂或固化副产物;可修复;良好的介电性能
道康宁®567无底涂有机硅灌封胶加热固化;无底漆粘合;弹性体
双组份室温缩合固化型灌封胶
道康宁®255无底涂弹性体快速室温及深层固化;自粘合性;室温下与大多数基材有良好的粘合性;粘结强度随时间增加而增强双组分;10:1混合;无腐蚀性;良好的介电性能;柔性弹性体;无需加热固化;可冷藏固化剂以达到长的保质期;锡催化剂不会受到抑制;在密闭环境下加热或加压会有发生逆反应的可能